Cutting (Wire saw, Dicing saw)
To carve out wafer from rude ore of crystal with appropriate angle and thinness, wire-saw cutting technology is adopted. This is a cutting technology where fluid with abrasive grain is supplied between a material and a thin line wire that reciprocates at high speed. A narrow diameter of the wire that is 0.1～0.2mm, enables to realize high productivity and efficiency even with small shaving margin.
Facilities in our factory
Products utilizing this technology
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Technology: Cut (PDF file:314KB)