Lapping / Polishing (Wafers of brittle material)
We are able to stably supply ultra-thin, high precision double sided lapping and polishing brittle wafers, focusing on crystal. In lapping process, the both sides of a wafer are polished simultaneously between upper and lower surface plates. It realizes high removal efficiency and processing accuracy. In polishing process, abrasive cloths are attached on surfaces of upper and lower surface plates and polish the both sides of the wafer simultaneously with finer abrasive grain to finish up to an extremely smooth mirror surface.
- Double sided lapping & polishing of thin brittle materials
- High precision process (reducing thickness variability)