MEMS

Forming technology of ultraminiature 3D structure, that is called as technology for the next generation

MEMS

MEMS

MEMS forms ultraminiature, high precision and high performance 3D structure by fully using microfabricating technology of semiconductors. It attracts attention as an upcoming technology from a wide variety of fields. We are able to give a consistent support to production that uses MEMS, from design and simulation to pre-production. As examples of past operations, we have experience with TSV (Through Silicon Via ), rewiring technology and microchannel. We are able to deal with various substrates such as Si and ceramics. As MEMS can integrate several functions, we will improve our technology to utilize it for production of more value-added products.

Fundamental technology

  • Design / Simulation
  • Thin film (metal oxide film, polyimide film)
  • Photolithography
  • Etching Wet / Dry etching
  • Micro Blast
  • Junction
  • Blade dicing / laser dicing

Facilities in our factory

Spin coater, Spray coater, Double sided aligner, Developing device, Wet etching equipment, RIE system, ICP-RIE system, Ashing device, Sputtering equipment, TEOS-CVD system, Thermal oxidation furnace, Laser dicing system, Blade system