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What is MEMS?
MEMS (Micro Electro Mechanical Systems) is a component, which is formed by integrating mechanical parts, sensors, actuators and electronic circuits on a silicon substrate, a glass substrate, an organic material or other materials, using the microfabrication technique.
Due to process limitations or different materials, the mechanical structure and the electronic circuit may use different chips. Such hybrid system is also called MEMS.
How does CITIZEN FINEDEVICE Co.,LTD. think about MEMS?
Since the MEMS processing technology was created, we have had more than 20 years experience and developed sensor MEMS, actuator MEMS and package MEMS.
Along with the above technology development, we have specialized in the micro-machining technology for substrate materials other than Si (ceramics, glass and crystal) continuously, established relevant systems, utilized crystal oscillator manufacturing technology and established wafer manufacturing process. And we provide services from cutting to packaging.
At present, the company is involved in the fields of electronic parts for people’s life, clock parts and medical industry. It realizes the achievement in mass production of medical detection boards, the realization of which is attributed to our proprietary substrate processing technology, and also reflects the advantages of film forming technology.
In addition to our products, we also have the ability to use MEMS technology and micro machining technology to manufacture precision molds.
In terms of trial production and development in the process, we combine the proprietary technologies to provide the best scheme, and as a wafer foundry, we can achieve one-stop production from wafer processing to packaging to meet the requirements of customers.
The history of MEMS
MEMS began with micro machining in the 1960s.
Strain gauges with the piezoresistive effect of monocrystalline silicon applied were developed around 1970 and used as strain sensors.
After that, isotropic and anisotropic silicon wet etching was developed, and it became possible to form physical structures in addition to piezoresistive elements. It has been used as a pressure sensor for automobiles since the latter half of the 1970s. At present, MEMS components are evolving into components with more complex mechanisms, such as acceleration sensors for automobile airbags, inkjet print heads, digital mirror devices and so on.
(Reference: Trends of MEMS Components and the Role of Vacuum Technology /Yasushi Goto, Akira Koide)
Product group with MEMS applied
MEMS was developed in the middle of the 20th century. It has been used for built-in acceleration sensors or gyroscopes in smart phones and other devices since 2000.
Its range of use has been expanded. As a movable semiconductor, MEMS technology is used in a wide range of fields such as vehicles / automatic driving, big data, AI, robotics, health care, environment and energy, and the latest relevant technologies emerge in endlessly.
CFD is realizing a wide range of application-aware product development, such as smart phones upgrades, IoT (Internet of things), automatic driving, VR (virtual reality), AR (augmented reality), 5G communications.
MEMS market includes areas in sensors (inertia, pressure, microphone, environment, optics, etc.), actuators (ink-jet print heads, microfluidic and RF, etc.), automobiles, household appliances, defense, health care, communication, aerospace and others.
The products, the final use of which are oriented to customers, account for 60%. According to the statistics of Yole Développement, a semiconductor market trend research company in France, its market scale was estimated to be US $7.13 billion in 2020.
It is forecast that the market will continue to expand at an average annual rate of 8% in the future, reaching US $11.27 billion in 2026.
The vehicle market ranks second, with the market scale reaching US $2.03 billion in 2020. It is expected to continue to expand at an average annual rate of about 6% in the future, reaching US $2.86 billion in 2026.
The communication infrastructure market, which is expected to grow rapidly in the future, is estimated to grow from US $60 million in 2020 to US $140 million in 2026, with an average annual expansion of about 17%.
|Technology||Devices||Machining dimension||Content for processing|
|Film forming||Deposition||Deposition devices||～6 inches||Metal, alloy, oxide film, nitride film, AuSn, special materials, etc|
|Sputtering||Sputtering devices||～6 inches||Metal, alloy, oxide film, nitride film, special materials, etc|
|SiO2 film forming||Thermal oxidation furnaces||～6 inches||SiO2 film formation (~5μm)|
|TEOS-CVD devices||～8 inches||SiO2 film formation|
|Galvanoformung, electroless galvanoformun||Galvanoformung and electroless galvanoformun devices||～4 inches||Ni、Cu、Au、SnAg|
|Printing||Screen printing devices||～8 inches||Electrode film, water-repellent film, oil-repellent film|
|Photolithography||Photoresist coating||Spin Coaters||～6 inches||Photoresist and polyimide coating|
|Coating machines||～8 inches||photoresist coating|
|Laminators||～6 inches||Dry film lamination|
|Baking||Baking ovens||～6 inches||Photoresist hardening|
|Hot plates||～6 inches||Photoresist hardening|
|Curing ovens||～6 inches||Polyimide hardening|
|Exposure||Contact aligners||～6 inches||Pattern formation (processing capacity : larger than 3 μm)|
|Steppers||～4 inches||Pattern formation (processing capacity : larger than 1 μm)|
|Developing||Puddle developing devices||～6 inches||Photoresist, polyimide development|
|Conveyors||～6 inches||Dry film development|
|Dip developing baths||～6 inches||Photoresist, polyimide, dry film development|
|Lift off||Lift-off devices||～4 inches||
Removing photoresist through swelling, shaking and ultrasonic
(processing capacity : larger than 5 μm)
|Etching||Dry etching||ICP-RIE devices||～6 inches||Si etching|
|RIE devices||～6 inches||Si and SiO2 etching|
|Blasting||Blasting devices||～8 inches||Si, glass and ceramic etching|
|Ion milling||Ion milling devices||～4 inches||Metal, SiO2 and Si etching|
|Laser machining||Laser-beam perforation machines||～6 inches||Si and ceramic perforation processing|
|Wet etching||Wet etching baths||～6 inches||Si, SiO2 and crystal etching|
|Substrate cutting||Cutting||Blade cutting devices||～6 inches||Substrate cutting|
|Substrate grinding||Lapping||Lapping devices||～6 inches||Substrate grinding|
|Polishing||Polishing devices||～6 inches||Substrate grinding|
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